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MC14042B Quad Transparent Latch
The MC14042B Quad Transparent Latch is constructed with MOS P-channel and N-channel enhancement mode devices in a single monolithic structure. Each latch has a separate data input, but all four latches share a common clock. The clock polarity (high or low) used to strobe data through the latches can be reversed using the polarity input. Information present at the data input is transferred to outputs Q and Q during the clock level which is determined by the polarity input. When the polarity input is in the logic "0" state, data is transferred during the low clock level, and when the polarity input is in the logic "1" state the transfer occurs during the high clock level.
Features
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PDIP-16 P SUFFIX CASE 648 16 MC14042BCP AWLYYWWG 1
* * * * * * * *
Buffered Data Inputs Common Clock Clock Polarity Control Q and Q Outputs Double Diode Input Protection Supply Voltage Range = 3.0 Vdc to 1 8 Vdc Capable of Driving Two Low-power TTL Loads or One Low-power Schottky TTL Load Over the Rated Temperature Range Pb-Free Packages are Available*
16 SOIC-16 D SUFFIX CASE 751B 1 14042BG AWLYWW
16 SOEIAJ-16 F SUFFIX CASE 966 1 A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Indicator MC14042B ALYWG
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol VDD Vin, Vout Iin, Iout PD TA Tstg TL Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Input or Output Current (DC or Transient) per Pin Power Dissipation, per Package (Note 1) Ambient Temperature Range Storage Temperature Range Lead Temperature (8-Second Soldering) Value -0.5 to +18.0 -0.5 to VDD + 0.5 10 500 -55 to +125 -65 to +150 260 Unit V V mA mW C C C
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2005
1
August, 2005 - Rev. 6
Publication Order Number: MC14042B/D
MC14042B
PIN ASSIGNMENT
Q3 Q0 Q0 D0 CLOCK POLARITY D1 VSS 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD Q3 D3 D2 Q2 Q2 Q1 Q1
TRUTH TABLE
Clock 0 1 1 0 Polarity 0 0 1 1 Q Data Latch Data Latch
LOGIC DIAGRAM
5 6 D1 7 LATCH 2 D0 4 LATCH 1 2 3 Q0 Q0
CLOCK POLARITY
10 9
Q1 Q1
D2
13
LATCH 3
11 12
Q2 Q2
VDD = PIN 16 VSS = PIN 8
D3
14
LATCH 4
1 15
Q3 Q3
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II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I I II IIII I IIIIIIII III IIII III I III II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I III I I II II I III I I I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I III I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II II IIII I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII IIII IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIII I II I I I I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I I I I I I III II IIII III I II II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIII II IIII I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I I I I III II IIII I II II IIII I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I IIII IIIII I I II II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
2. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 3. The formulas given are for the typical characteristics only at 25_C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL - 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.004.
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Total Supply Current (Notes 3 & 4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs all buffers switching)
Quiescent Current (Per Package)
Input Capacitance (Vin = 0)
Input Current
Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc)
Input Voltage "0" Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc)
Output Voltage Vin = VDD or 0
(VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc)
(VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc)
Vin = 0 or VDD
Characteristic
"1" Level
"1" Level
"0" Level
Source
Sink
Symbol
VOH
VOL
IOH
VIH
IDD
IOL
Cin
VIL
Iin
IT
VDD Vdc
5.0 10 15
5.0 10 15
5.0 10 15
5.0 5.0 10 15
5.0 10 15
5.0 10 15
5.0 10 15
5.0 10 15
15
-
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- 3.0 - 0.64 - 1.6 - 4.2 4.95 9.95 14.95 0.64 1.6 4.2 Min 3.5 7.0 11
MC14042B
- - -
-
-
- - -
- - -
- 55_C
3 0.1 0.05 0.05 0.05 Max 1.0 2.0 4.0 1.5 3.0 4.0 - - - - - - - - - - - - - - - 2.4 - 0.51 - 1.3 - 3.4 4.95 9.95 14.95 0.51 1.3 3.4 Min 3.5 7.0 11 IT = (1.0 mA/kHz) f + IDD IT = (2.0 mA/kHz) f + IDD IT = (3.0 mA/kHz) f + IDD - - - - - - - - - - - 0.00001 Typ (Note 2) - 4.2 - 0.88 - 2.25 - 8.8 0.002 0.004 0.006 25_C 0.88 2.25 8.8 2.75 5.50 8.25 2.25 4.50 6.75 5.0 5.0 10 15 0 0 0 - - - - - - - - - - - - - 0.1 0.05 0.05 0.05 Max 1.0 2.0 4.0 7.5 1.5 3.0 4.0 - 1.7 - 0.36 - 0.9 - 2.4 4.95 9.95 14.95 0.36 0.9 2.4 Min 3.5 7.0 11 - - - - - - - - - - - 125_C 1.0 0.05 0.05 0.05 Max 30 60 120 1.5 3.0 4.0 - - - - - - - - - - - - - - mAdc mAdc mAdc mAdc mAdc Unit Vdc Vdc Vdc Vdc pF
MC14042B
II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIII I I I I IIII II IIIIIIIIIIIIIIIIIIIIIIIIIIII III I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I IIIII I IIII II III I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I II IIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII IIIII II I IIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I III I I I I I III II III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII I I I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIII III I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I III I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I III IIIIIIIIIIIIIIIIIII IIII I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I III I II I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIII I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIII
SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)
Characteristic Symbol tTLH, tTHL VDD Min Typ (Note 6) 100 50 40 220 90 60 220 90 60 150 50 40 - - - Max Unit ns Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns Propagation Delay Time, D to Q, Q tPLH, tPHL = (1.7 ns/pF) CL + 135 ns tPLH, tPHL = (0.66 ns/pF) CL + 57 ns tPLH, tPHL = (0.5 ns/pF) CL + 35 ns Propagation Delay Time, Clock to Q, Q tPLH, tPHL = (1.7 ns/pF) CL + 135 ns tPLH, tPHL = (0.66 ns/pF) CL + 57 ns tPLH, tPHL = (0.5 ns/pF) CL + 35 ns Clock Pulse Width 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 - - - - - - - - - 200 100 80 440 180 120 440 180 120 - - - tPLH, tPHL no tPLH, tPHL ns tWH ns 300 100 80 - - - Clock Pulse Rise and Fall Time tTLH, tTHL ms 15 5.0 4.0 - - - - - - Hold Time th ns 100 50 40 50 30 25 50 25 20 0 0 0 Setup Time tsu ns 5. The formulas given are for the typical characteristics only at 25_C. 6. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance.
ORDERING INFORMATION
Device MC14042BCP MC14042BCPG MC14042BD MC14042BDG MC14042BDR2 MC14042BDR2G MC14042BFEL Package PDIP-16 PDIP-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) SOEIAJ-16 Shipping 500 Units / Rail 500 Units / Rail 48 Units / Rail 48 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel 2000 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC14042B
16 5 6 PULSE GENERATOR 1 4 7 13 14 VDD 20 ns CLOCK POLARITY D0 D1 D2 D3 8 VSS Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3 2 3 10 9 11 12 1 15 DATA INPUT 1 f 90% 50% tPLH 90% Q OUTPUT 10% tTLH Q OUTPUT tPHL 90% 10% tTHL 50% tTLH
20 ns 10% tPHL 50% tTHL
For Power Dissipation test, each output is loaded with capacitance CL.
Figure 1. AC and Power Dissipation Test Circuit and Timing Diagram (Data to Output)
VDD 16 PULSE GENERATOR 1 PULSE GENERATOR 2 5 6 4 7 13 14 NOTE: CL connected to output under test.
CLOCK POLARITY D0 D1 D2 D3 8 VSS
Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3
2 3 10 9 11 12 1 15
20* ns 90% CLOCK INPUT P.G. 1 10% 20 ns
20 ns
50% tWH 90%
50% tsu th
DATA INPUT P.G. 2 Q OUTPUT 90% 50% 10%
tPLH
*Input clock rise time is 20 ns except for maximum rise time test.
Figure 2. AC Test Circuit and Timing Diagram (Clock to Output)
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MC14042B
PACKAGE DIMENSIONS
PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE T
-A-
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL.
B
1 8
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
DIM A B C D F G H J K L M S
INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040
MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
SOIC-16 D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J
-A-
16 9
-B-
1 8
P
8 PL
0.25 (0.010)
M
B
S
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
G F
K C -T-
SEATING PLANE
R
X 45 _
M D
16 PL M
J
0.25 (0.010)
TB
S
A
S
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MC14042B
PACKAGE DIMENSIONS
SOEIAJ-16 F SUFFIX PLASTIC EIAJ SOIC PACKAGE CASE 966-01 ISSUE O
16
9
LE Q1 E HE M_ L DETAIL P
1
8
Z D e A VIEW P
c
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031
b 0.13 (0.005)
M
A1 0.10 (0.004)
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MC14042B
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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MC14042B/D

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